MediaTek is pretty much unknown in the U.S. as most of its chips are found inside devices that are made and sold in China. But if current reports are true, Apple is about to give the company a huge shot of publicity, stateside. Thanks to its quarrels with Qualcomm, Apple appears to be ready, willing and able to replace the Snapdragon modems that might have been deployed on the 2018 CDMA flavored iPhone units, with MediaTek’s version of the broadband chip.
MediaTek is also believed to be working on a couple of mid-range chipsets, the Helio P40 and Helio P70. If the rumors are legit, both are being built by TSMC using the 12nm process, and figure to arrive in Q2 of 2018. The Helio P40 carries an octa-core CPU with four A73 cores clocked at 2GHz to do the heavy lifting, and four A53 cores, also clocked at 2GHz, for the light housekeeping. The GPU is the Mali-G72 MP3 clocked at 700MHz, and the chip supports cameras up to 32MP. The chipset is compatible with up to 8GB of RAM. There is support for LTE Cat. 7.
The Helio P70 also carries an octa-core CPU. The configuration is almost exactly the same as found with the Helio P40 except for the faster 2.5GHz clock speed available on the two A73 cores. The P70 comes with a quad-core Mali-G72 GPU clocked at 800MHz, and is compatible with 8GB of LPDDR4X RAM. The Helio P70 is said to be expected inside full-screen Xiaomi Redmi models, and handsets produced by Vivo, Oppo, and Gionee.
Low sales of the high-end Helio X30 chipset, found this year inside only two two handsets (Meizu Pro 7 Plus and Meitu V6) forced MediaTek to back off a new Helio X SoC for 2018. As we recently told you, the company’s market share declined from 18% in 2016 to 14% last year.
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source: CounterpointReserach via GizChina